S7U4E002002 seiko epson corporation micro 6 dof sensor evaluation module ? features z micro evaluation board for 6 dof sensor ah-6120lr z easy to implement it into handy equipment by super compact design with single function z supports optional micro usb i/f board ? specifications z components 6dof sensor + 16bits mcu z 6dof sensor ah-6120lr (epson toyocom) z mcu s1c17 series (seiko epson) z gyro 3 axis (x, y, z) range: +/-1000 dps, sensitivity: 1.462857lsb/dps (vdd=2.8v) z acceleration 3 axis (x, y, z) range: +/-6 g sensitivity: 273.0667lsb/g z interface uart z power supply 2.8 to 3.3v z connector df37nc-20ds (hirose electric) adopted connector : df37c- 20dp (hirose electric) z size 10 x 17 x 5.7 mm z optional usb i/f board s7u4e002a01 (seiko epson) dimensions 3pin terminal (cn3) 3pin terminal (cn1) mcu 6dof inertial sensor a h-6120lr hole for fixation 0.6mm 20pin connector df37nc-20ds
S7U4E002002 block diagrams 20pin connector (cn2) mcu ah-6120lr reset ic (vdet=2.0) x?tal 32.768khz 3pin terminal (cn1) vdd=2.8-3.3v uart reset uart_sin uart_sout 3pin terminal (cn3) vdd uart_sin uart_sout #reset gnd uart_sin uart_sout vdd gnd #reset vdd analog data evaluation board/kit and development tool important notice 1. this evaluation board/kit or development tool is designed fo r engineering evaluation, demonstration, or development purposes only. do not use it for any other purpose. it is not intended to meet the requirements of design for a finished product. 2. this evaluation board/kit or development tool is intended for use by an el ectronics engineer and is not a consumer product. the user should use these goods properly and safely. se iko epson does not assume any responsibility or liability of any kind if damage a nd/or fire is caused by its use. the user s hould cease to use the evaluat ion board/kit or development tool when any abnormal issue oc curs, even during proper and safe use. 3. the part used for this evaluation board/kit or development tool may be changed without any notice. notice: no part of this material may be reproduced or duplicated in any fo rm or by any means without the written permission of seiko ep son. seiko epson reserves the right to make c hanges to this material without notice. se iko epson does not assume any liability of a ny kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, furt her, there is no representation that this material is app licable to products requiring high level reliab ility, such as, medical products. moreo ver, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that any thing made in accordance with this material will be free from any patent or copy right infringement of a third party. this material or portions thereof may contain technology or the subject relati ng to strategic products under the control of the foreign exchange and foreign trade la w of japan and may require an export license from the ministry of economy, trade and industry or other approval from another government ag ency. all brands or product names mentioned herein are trademarks and/ or registered trademarks of t heir respective companies. ? seiko epson corporation 2011, all rights reserved epson s y stem p roducts website microdevices operations division htt p ://www.e p son. jp /e / p roducts /de vice /m icro _ s y stem / system business development group device sales & marketing department 421-8 hino, hino-shi, tokyo 191-8501, japan document code: 4121756 00 first issue july, 2011 phone: +81-42-587-8291 fax: +81-42-587-5116 2
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